| 摘要 |
PURPOSE:To eliminate the need for the use of heat sink, reduce the size of element disposition base floor part and lower cost by providing a notched part to part of a resin-made package enclosing the semiconductor element and beforehand packing heat conductive resin therein. CONSTITUTION:A semiconductor element 1 is secured onto a semiconductor element disposition base floor part 14 and the electrodes of the element are connected to deriving leads 2, 2' via bonding wires 3, 3'. Thereafter, the element 1 is enclosed with a package 15 composed of epoxy resin or other, with the leads 2, 2' being projected to the outside. At this time, a notched part 16 is beforehand formed on the back of the base floor part 14 of the package 15 and the epoxy resin 17 which has been increased in heat conductivity by mixing fine silver particles is packed therein. Then, the heat radiation from the element is made better and the need for costly heat sink is eliminated. |
