| 摘要 |
PURPOSE:To eliminate warpage of substrate by beforehand depositing metal layers selected from Al-Pd, Ti-Ni, Cr-Au or Ag, or Au.Ga alloy-Ag in this order on a Si substrate surface and mounting the support electrode plate of Cu C-fiber composite material by way of solder here. CONSTITUTION:A metal layer 4 is beforehand fomed on a si substrate 1 and a support electrode 2 mainly composed of Cu and C fibers whose coefficient of thermal expansion has been made nearly the same as that of Si is secured thereto by way of a solder layer 3. Here, the metal layer 4 is constituted by an Al layer 11, Ti or Pd layer 12, Ni or Cr or their alloy layer 13, Au or Ag layer 15 from the substrate 1 side. Then, the laminate does not produce warpage owing to thermal shrinkage even after it undergoes the process of being subjected to heat, hence no stresses are generated in the substrate 1. |
