| 摘要 |
<p>PURPOSE:To increase the strength to bending and miniaturize package for resin sealing by providing bent parts and linear parts to bonding wires for connecting to electrode deriving leads thereby decreasing the rising heights of the wires. CONSTITUTION:The collector elecdtrode side of a semiconductor element 1 is placed on the semiconductor element disposing base floor 2C' of one end of a collector elecdtrode deriving lead 2C and is secured by using solder. Next, the base electrode of the element 1 is connected to a base electrode driving lead 2B by means of a bonding wire 13B and likewise the emitter electrode of the element 1 is connected to an emitter electrode deriving lead 2E by using a wire 13E. At this time, the stringing shape of the wires 13E, 13B is so formed as to become cramp form when viewed laterally. Namely, with the wire 13B, bent parts 13BF and 13BF' and linear part 13BL are provided to the wire 13B, whereby the rising L of the wire is reduced and the strength to bending is increased.</p> |
