发明名称 THIN-FILM MICROCIRCUIT BOARD AND METHOD FOR MAKING THE SAME
摘要 Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO2 or In2O3, which is not easily dispersible upon application of the above energy.
申请公布号 GB2006538(A) 申请公布日期 1979.05.02
申请号 GB19780040961 申请日期 1978.10.18
申请人 ASAHI KASEI KOGYO KK 发明人
分类号 C23C14/04;H01L27/01;H05K3/02;(IPC1-7):05K3/00;05K1/00 主分类号 C23C14/04
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