SUBSTRATS VERRE-CERAMIQUE ET LEUR PROCEDE DE FABRICATION

摘要

Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000 DEG C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.