| 摘要 |
A semiconductor wafer 10 comprises a plurality of undiced chips X1Y1XnYm each including, in addition to conventional circuits, control circuits for transferring signals from an input to one of a plurality of outputs, which are connected to different adjacent chips XiYj so that the chips can be tested serially, "bad" chips being disregarded, and a continuous chain of sound chips being built up. In order to increase the chain length, the outputs of chips XiYm on one edge of the wafer 10 are connected by conductors 12 to the inputs of chips XiY1 on the opposite edge, so that the chips XiYj effectively lie on a cylindrical surface. Similarly, by different connections of the conductors 12, and using further conductors 14, the chips XiYj may be made to effectively lie on a toroid or an endless helix. <IMAGE> |
