| 发明名称 |
Method of improving the adherence of metallic conductive lines on polyimide layers |
| 摘要 |
A method of improving the adherence of conductive metallic lines to a polyimide resin layer by incompletely curing the polyimide resin prior to deposition of the metal layer, and subsequently completely curing the polyimide resin layer after the metal layer is deposited.
|
| 申请公布号 |
US4152195(A) |
申请公布日期 |
1979.05.01 |
| 申请号 |
US19770825626 |
申请日期 |
1977.08.18 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
BAHRLE, DIETER;FRASCH, PETER;KONIG, WILFRIED;SCHWERDT, FRIEDRICH;THELEN, URSULA;VOGTMANN, THEODOR |
| 分类号 |
B32B15/04;B32B15/08;B32B15/088;C08J5/12;C23C14/20;H01L21/312;H01L21/3205;H01L21/768;H01L23/522;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B05D3/02;B05D1/38 |
主分类号 |
B32B15/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
