| 摘要 |
<p>PURPOSE:To prevent dust particles from adhering and a wafer from being contaminated by a method wherein a treatment and an operation in individual units are executed in a necessary prescribed atmosphere and the wafer is shifted between the individual units in a vacuum state. CONSTITUTION:Untreated wafers 23 are taken out from a loading unit 2 by using a first handling unit 13; they are fed one after another; whenever each treatment is finished, they are fed in succession to a treatment in a next process by using a second handling unit 14; the wafers whose treatment has been completed are housed in an unloading unit 3. These wafers are sfifted between individual units via a Conveyance unit 1 and in a vacuum. Thereby, it is possible to prevent the wafers from being contaminated between the individual treatments and to prevent dust particles from adhering; a high quality can be realized.</p> |
