COMPOSITION FOR FORMING THERMAL DECOMPOSITION PARTICLE CONTAINING NO SOLVENT NOR RESIN

摘要

A solventless, resinless composition is disclosed of at least one compound stable at 60.degree.C which thermoparticulates between 80.degree.C and 200.degree.C, and at least one grease, unreactive with the thermoparticulating compound, and stable at the compound's thermoparticulation temperature. The composition is applied to a portion of an electrical apparatus which is exposed to a gas stream. When the electrical apparatus overheats, the thermoparticulating compound in the coating forms particles in the gas stream which are detected by a monitor.