| 摘要 |
PURPOSE:To avert the separation of back lining elecrodes by mechanically shaving the back of a semiconductor substrate to let distortions be produced to a state of allowing easy formation of eutectic and evaporating a back lining electrode there and securing the same to a header or frame. CONSTITUTION:A base region 12 and an emitter region 13 are formed on a semiconductor substrate 11, and electrodes 14, 15 are mounted to these regions respectively. The surface of the substrate 11 is beforehand protected with wax 16. Next, a plurality of such substrates 11 are fixed on a rotary base 17 and the back of the substrates 11 is ground and removed 100 to 130mum by rotating the cup wheel 18 secured with diamonds at the end. Thereafter, the wax 16 is removed and the substrate is scribed to pellets. The pellet is then placed on a header or frame 20 via gold-chrome perform material 19. The preform material 19 is fused by heating and the assembly is secured while rubbing the same. Then, eutectic is liable to form and securing becomes sure. |
