发明名称 |
DUENNFILMMIKROSCHALTUNG, IHRE HERSTELLUNG UND VERWENDUNG |
摘要 |
Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby removing exposed portions of the thin-film laminate as a result of dispersion and evaporation thereof. Unexposed portions of the thin-film laminate provide a desired pattern. The electrical property-imparting film is a thin-film of noble metal such as gold, silver or platinum or a thin film of transparent electrode material such as SnO2 or In2O3, which is not easily dispersible upon application of the above energy. |
申请公布号 |
DE2845891(A1) |
申请公布日期 |
1979.04.26 |
申请号 |
DE19782845891 |
申请日期 |
1978.10.21 |
申请人 |
ASAHI KASEI KOGYO K.K. |
发明人 |
SHIBASAKI,ICHIRO;OHMURA,KAORU;KIMURA,TAKEO;KOBAYASHI,HIDEHIKO |
分类号 |
C23C14/04;H01L27/01;H05K3/02;(IPC1-7):H01L49/02 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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