| 摘要 |
PURPOSE:To secure a correct shape of the thin film and thus to enhance the characterisitcs of the elastic surface wave element through an etching process into the necessary form after evaporating the piezoelectric thin film onto the entire surface of the substrate. CONSTITUTION:Piezoelectric thin film 9 is evaporated on the entire surface of surface wave element substrate 6, and then an etching process is given to secure a fixed form. With this etching process, thin film 9 is also removed at the areas of electrode terminal 8a and 8b. In this way, film 9 remaining on substrate 6 becomes uniform, and thus the beat pattern so far recognized due to the film thickness distribution can be eliminated. Thus, the characteristics of the surface wave element can be enhanced. Furthermore, no film 9 remains on electrode 8a and 8b, thus eliminating the obstacles for the wiring or bonding. |
