| 摘要 |
A metals recovery apparatus and process for use with an electroplating system acting to remove metals from a used plating solution. The present apparatus includes a plating tank and a pair of electrode plates in spaced parallel relationship. There is a plating solution circulating system in the plating tank for moving the solution between the electrodes in a swirling motion and for adding a controlled amount of additional solution. The circulating system is provided with directional nozzles to cause the swirling motion of the plating solution, which provides a more uniformly distributed plating pattern on the cathode plate.
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