发明名称 Method involving pulsed light processing of semiconductor devices
摘要 A pulsed laser or flash lamp produces a short duration pulse of light for thermal processing of selected regions of a semiconductor device. The light pulse is directed towards the semiconductor device and irradiates selected surface regions of the device to be processed. Energy deposited by the light pulse momentarily elevates the temperature of the selected regions above threshold processing temperatures for rapid, effective annealing, sintering or other thermal processing. The characteristics of the light pulse are such that only those surface vicinity regions to be processed are elevated to a high temperature and the remaining mass of the semiconductor device is not subjected to unnecessary or undesirable high temperature exposure.
申请公布号 US4151008(A) 申请公布日期 1979.04.24
申请号 US19770780416 申请日期 1977.03.23
申请人 SPIRE CORP 发明人 KIRKPATRICK, ALLEN R
分类号 H01J37/305;H01L21/265;H01L21/268;(IPC1-7):H01L21/26 主分类号 H01J37/305
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