发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
A method of manufacturing a semiconductor device having a transistor structure in which the emitter zone comprises a lower-doped region adjoining the base zone and a more highly-doped region adjoining the surface. According to the invention, the more highly-doped part is obtained by the introduction of doping atoms through an undoped polycrystalline layer provided on the surface. Preferably, a thin silicon nitride or silicon oxide layer is provided between the surface and the polycrystalline silicon layer prior to providing the latter.
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申请公布号 |
US4151006(A) |
申请公布日期 |
1979.04.24 |
申请号 |
US19770788732 |
申请日期 |
1977.04.19 |
申请人 |
U S PHILIPS CORP |
发明人 |
DE GRAAFF, HENDRIK C;HART, PAUL A H;SCHMITZ, ALBERT;SLOTBOOM, JAN W |
分类号 |
H01L29/04;H01L21/00;H01L21/225;H01L21/331;H01L29/08;H01L29/73;(IPC1-7):H01L29/72;H01L21/26 |
主分类号 |
H01L29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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