发明名称 Method of manufacturing a semiconductor device
摘要 A method of manufacturing a semiconductor device having a transistor structure in which the emitter zone comprises a lower-doped region adjoining the base zone and a more highly-doped region adjoining the surface. According to the invention, the more highly-doped part is obtained by the introduction of doping atoms through an undoped polycrystalline layer provided on the surface. Preferably, a thin silicon nitride or silicon oxide layer is provided between the surface and the polycrystalline silicon layer prior to providing the latter.
申请公布号 US4151006(A) 申请公布日期 1979.04.24
申请号 US19770788732 申请日期 1977.04.19
申请人 U S PHILIPS CORP 发明人 DE GRAAFF, HENDRIK C;HART, PAUL A H;SCHMITZ, ALBERT;SLOTBOOM, JAN W
分类号 H01L29/04;H01L21/00;H01L21/225;H01L21/331;H01L29/08;H01L29/73;(IPC1-7):H01L29/72;H01L21/26 主分类号 H01L29/04
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