发明名称 CONJUNTO DE ACONDICIONAMENTO PARA MECANISMO ELETRONICO
摘要 A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board. Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated. The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electrical leads are installed which connect the package to other electronic components.
申请公布号 BR7803817(A) 申请公布日期 1979.04.17
申请号 BR19787803817 申请日期 1978.06.15
申请人 BENDIX CORP 发明人 LEADBETTER L;CARP R;GOSNELL T;WALKER B;HYDER R
分类号 H05K5/00;H01L23/02;H05K3/32;H05K3/34;H05K7/02;H05K7/14;(IPC1-7):H05K5/00;H05K10/00 主分类号 H05K5/00
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