| 摘要 |
A cooling arrangement for the operating components of an electronic system such as semiconductor valves in disk form comprises cylindric heat sinks having the end faces in contact with the faces of adjacent semiconductor valves to establish flow of heat from the semiconductor disks to the heat sinks, an annular vessel formed at the periphery of each heat sink and a radial array of inclined cooling pipes communicating with the interior of the vessel. The vessel is partially filled with a cooling fluid which, during operation of the valve system is in a liquid as well as a vapor phase. The fluid vapor is forced outwardly along the tubes where it is re-condensed along the tube walls and flows back by gravity.
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