| 摘要 |
A process for depositing nickel on a non-metallic basis material from a chemical nickel plating bath containing a hypophosphite as a reducing agent to form a nickel coating on the basis material, the coating being indispensable for the practice of the subsequent electroplating, characterized in that the bath contains, as a second reducing agent, a member selected from the group consisting of 1-ascorbic acid, its salts, and any substances which will produce 1-ascorbic acid when incorporated in the bath as one of the components thereof, thereby to eliminate the sensitizing pre-treatment required for the conventional processes for chemically plating a non-metallic basis material with nickel.
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