发明名称 |
Deep diffusion zone prodn. in doped semiconductor - by applying second dopant or non-dopant around zone before thermal treatment, avoiding lateral spread |
摘要 |
<p>Prodn. of deep diffusion zones in a doped semiconductor substrate is effected by introducing a first dopant through a maks into the surface of the substrate, followed by diffusion during thermal treatment. The novel feature is that (a) a second dopant is introduced into the surface through a second doping mask, with windows complementary to (part of) the lateral boundaries or (b) a dopant or (c) non-dopant is introduced over the entire surface, before thermal treatment. Pref. the concn. of the second dopant is much higher than that of the first. Pref. the substrate is p-Si, the first dopant P or As, the second dopant (a) B, Al or Ga, (b) In and the non-dopant (c) a noble gas.</p> |
申请公布号 |
DE2743853(A1) |
申请公布日期 |
1979.04.12 |
申请号 |
DE19772743853 |
申请日期 |
1977.09.29 |
申请人 |
SIEMENS AG |
发明人 |
KRIMMEL,EBERHARD,DR.;HOFFMANN,KURT,DR.-ING. |
分类号 |
H01L21/225;(IPC1-7):H01L21/22 |
主分类号 |
H01L21/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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