| 摘要 |
PURPOSE:To easily obtain a rand portion of a prescribed size and produce a superior multilayer printed plate by carrying out total copper plating of a copper lined, laminated plate, including through holes, formed by covering the surface copper foil layers with easily detachable metal thin films and then removing the plated layers on the thin films together with the films. CONSTITUTION:Both the sides of a usual copper lined plate consisting of copper foil 3, laminated base material 2 and copper foil 3 are covered with metal thin films 9 such as copper foil to form copper lined, laminated plate 1 used as a printed plate substrate. A necessary no. of through holes are made in plate 1 by drilling and total copper plating 5 is carried out. Next an edge tool is slid along detachable bond face 10 of each film 9 to scrape film 9 and plated layer 11 on film 9, and plated layer 12 alone inside each through hole 4 is left. A photoresist layer is sticked to the surface copper foil and a printed circuit is exposed. Thereafter, dry film 13 is attached and etching is carried out to simultaneously form a printed circuit, plated through holes and rand portion 6. |
