Hot-melt adhesive compositions

摘要

A novel hot-melt adhesive composition comprising 100 parts by weight of a polyamide copolymer resin having a melting point of about 80 DEG to about 160 DEG C. and composed of at least three monomers, about 5 to about 30 parts by weight of a terpene-phenol resin having a softening point of about 80 DEG to about 120 DEG C., and about 5 to about 10 parts by weight of a plasticizer.