| 摘要 |
<p>PURPOSE:To separate the wafer by providing scribing grooves different in whidth at the both sides of wafer and by depressing them from the side of broader width. CONSTITUTION:The mesa groove 11 at the roller side 16 of wafer is broader for the groove width and shallower in comparison with the groove 12 on the other side. Especially, the cracking for unnecessary part can be prevented with different depth.</p> |
