| 摘要 |
A flexible printed circuitry board assembly having a plurality of rigid printed circuit boards spaced apart but mechanically and electrically connected by a thin flexible printed circuitry board which is bonded to one side of each rigid board. The assembled board is reverse-bonded to align the rigid boards in stacked, parallel positions and are held in position by a pair of metallic support plates. A heat sink, having a plurality of resilient fingers, is attached to each support plate and the resilient fingers support the assembled board within a metallic housing and transfer heat from the assembled board to the housing.
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