发明名称 Method of fabricating conductive buried regions in integrated circuits and the resulting structures
摘要 In an oxide isolated semiconductor structure having an epitaxial layer formed on a monocrystalline substrate, a buried, laterally extending, PN junction in said structure, and oxidized isolation regions extending through said epitaxial layer to said PN junction, thereby to form a plurality of electrically isolated pockets of semiconductor material, a dopant is located in those regions of the semiconductor material directly adjacent the oxidized isolation regions. This dopant is often referred to as the field predeposition.
申请公布号 US4149177(A) 申请公布日期 1979.04.10
申请号 US19760720550 申请日期 1976.09.03
申请人 FAIRCHILD CAMERA AND INSTRUMENT CORPORATION 发明人 ALTER, MARTIN J.
分类号 H01L27/04;H01L21/74;H01L21/76;H01L21/762;H01L21/822;(IPC1-7):H01L27/04 主分类号 H01L27/04
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