LOW FUSINGGPOINT GLASS SEALING LEAD

摘要

PURPOSE:To obtain a low fusing-point glass sealing lead which needs no oxide film, by giving annealing in the reducing atomosphere. CONSTITUTION:The lead of iron-Ni-Cr alloy undergoes an annealing process about 10 minutes in the dry H2 of 900 deg.C. As a result, the soldering is much facilitated since no oxide film exists on the surface. Furthermore, no crack is caused at the glass sealing part when the bending process is applied because the lead is softened.