首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR ELEMENT BONDING METHOD AND ITS BONDING UNIT
摘要
申请公布号
JPS5443678(A)
申请公布日期
1979.04.06
申请号
JP19770110743
申请日期
1977.09.13
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
MAKINO YUTAKA;TAKAYANAGI TAKEO;ISOYA HIROSHI;MASAMOTO TAKASHI;FUJITA HIKARI
分类号
H01L21/68;H01L21/60;H01L21/603
主分类号
H01L21/68
代理机构
代理人
主权项
地址
您可能感兴趣的专利
DEVICE FOR DETECTING OBJECTS IN A SEQUENCE OF IMAGES
CROSS-LINKED CONDUCTIVE POLYMERS AND ANTISTAT LAYERS EMPLOYING THE SAME
NOVEL METHODS FOR PRODUCING ANTIGEN-SPECIFIC, HIGH-AFFINITY HUMAN MONOCLONAL ANTIBODIES
ALKALI-FREE BIOACTIVE SOL-GEL COMPOSITIONS
PRINTING CYLINDER ENGRAVING
MULTITRACK MAGNETIC HEAD
MAGNETIC HEAD
PRETREATMENT FOR CLEANING OF CARBON SUBSTRATE FOR MEDIA
MAGNETORESISTANCE EFFECT TYPE HEAD
FLEXIBLE MAGNETIC DISK DEVICE
CUP TYPE AUTOMATIC VENDING MACHINE
METHOD FOR PROCESSING IMAGE
RULED LINE EDITOR
CONSOLE CONNECTION SYSTEM FOR MAINTENANCE
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
DATA STORING SYSTEM
PROGRAMMABLE CONTROLLER
WEB CASSETTE DEVICE
HEAT ROLL FOR FIXING
AUTOMATIC TUNING CONTROLLER