| 摘要 |
<p>Epoxy resin compsn. comprises (a) 2-80 wt. % of a solid epoxy resin and (b) 80-20 wt. % of a solid phenolic resol resin with a softening pt. of 70-90 degrees C, a gel time at 150 degrees C of >=80 sec. and a methylol index 25-45. Pref. the epoxy resin is a bisphenol A type with a softening point of 65-140 degrees C. The phenolic resol resin is pref. a phenol-formaldehyde, cresol-formaldehyde or bisphenol A-formaldehyde resol resin made using ammonia soln. or a prim or sec. amine as basic condensn. catalyst. The prods. are esp. useful as powder coating compsns which cure rapidly on stoving to give cured coating films with excellent adhesion, impact resistance and chemical resistance.</p> |
