发明名称 Wire channel for distributing wires in high density circuits - has slots in its sides for wire ends and is put upside down between rows of soldering tags
摘要 <p>The wires are laid between rows of soldering tags, with their ends correctly clamped in slots of the U-shaped channel whose open side faces the clamped ends of the tags. The channel is placed between the rows of tags, and its open slots reach in the channel sides and/or its bottom up to the connection point of the wires. The distance between the channel (8) sides is equal to the distance between the tags, and the channel (8) sides and/or its bottom have recesses for the tags.</p>
申请公布号 DE2743464(A1) 申请公布日期 1979.04.05
申请号 DE19772743464 申请日期 1977.09.27
申请人 SIEMENS AG 发明人 PELZL,LEO
分类号 H02G3/04;(IPC1-7):02B1/20 主分类号 H02G3/04
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