| 摘要 |
PURPOSE:To make it possible to form a fine pattern and prevent damage to the surface of an enamel substrate by steps of forming a metal layer on the enamel substrate by electroless plating, forming a plating resist for circuit patterning the metal layer by photolithography, forming an etching resist on the patterned metal layer, removing the plating resist with a solvent, and removing the exposed part of the metal layer using an alkali etching agent. CONSTITUTION:A metal substrate is coated with a crystallized glass containing BaO, SiO2, MgO, and B2O3 by migration electrodeposition and by using an enamel substrate obtained by firing, a metal layer is formed by electroless plating. Next, a plating resist for patterning the metal layer is formed by photolithography. Next, an etching resist is formed on the patterned metal layer and the plating resist is removed with a solvent. The part of the metal layer exposed from the removal with the solvent is removed with an alkali etching agent of pH8 to 13. |
