发明名称 Component cooling in communication and measurement equipment - uses metal plate coated with insulating foil which carries components and printed circuit
摘要 <p>Components to be cooled are mounted through an insulating layer on an aluminium plate. The metal plate (3) is coated on its both sides with an insulating foil (5, 6). A printed circuit (9) is produced on the plate one side with components (1) which rest on the other side on the foil (5). The component (1) leads (7) pass through larger holes (8) in the plate (3) and both foils (5, 6) and are soldered to conductors of the printed circuit (9).</p>
申请公布号 DE2743647(A1) 申请公布日期 1979.03.29
申请号 DE19772743647 申请日期 1977.09.28
申请人 SIEMENS AG 发明人 ZENKERT,HEINRICH,ING.;LEUTERITZ,HEINZ,ING.
分类号 H05K1/02;H05K3/00;H05K3/34;H05K3/44;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K1/02
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