| 摘要 |
The hot melt adhesives of the present invention comprise a blend of at least one polyethylene resin, an ethylene/lower alkyl acrylate copolymer, a tackifying resin, and a high density, low viscosity, polyethylene wax having a molecular weight of about 1000. This hot melt adhesive has a novel combination of properties including excellent elevated temperature properties, and provides excellent adhesion to nonporous substrates such as aluminum foil.
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