An embossing tool which has an elongated body along which is formed a tape path leading from a supply-receiving cavity at one end to the embossing die members at the opposite end. This embossing tool utilizes a tape path which leads to the periphery of the die members and between two apposed die members and then toward the center of the die members. The cut-off member is positioned along the path and adjacent the outer periphery of the die members.
