| 摘要 |
A timepiece circuit device including an upper frame, a lower frame and a print base board having a conductive pattern for mounting and electrically connecting a semiconductor device. At least one of said upper and lower frames is provided with a connecting portion electrically connecting electronic parts and a recess in which said electronic part is fitted and said semiconductor device is received. Said upper frame, said circuit base board and said lower frame are overlapped with each other thereby providing a circuit device having semiconductor devices capable of being miniaturized for a timepiece.
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