发明名称 MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To obtain a laminated ceramic electronic component having improved transferability by a method wherein an electrode is formed on the ceramic raw sheet provided on a base film, and after the ceramic raw sheet has been coated with a ceramic slurry the ceramic slurry is dried up, and an electrode- buried ceramic raw sheet is transferred to the electrode. CONSTITUTION:A heating plate 27, which is heated up by a heater 26, is placed on the side where the electrode-buried ceramic raw sheet 25 is formed. On the other hand, the base film 21, which is fixed to a stand 20, and a ceramic raw laminated body 22 are placed on the side where the electrode-buried ceramic raw sheet 25 of the base film 21a is formed. Then, the electrode-buried ceramic raw sheet 25, formed on the surface of the base film 21a, is heated up and fixed by pressure to the surface of the ceramic raw laminated body 22 by the heating plate 27. Then, the electrode-buried ceramic raw sheet 25 on the base film 21a is transferred to the surface of the ceramic raw laminated body 22, and an electrode-buried ceramic raw sheet 26 is formed.</p>
申请公布号 JPH02114614(A) 申请公布日期 1990.04.26
申请号 JP19880268448 申请日期 1988.10.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAO KEIICHI;OKINAKA HIDEYUKI;HORIBE YASUTAKA;OKUYAMA HIKOHARU;KATO MASAHIRO;OOMI SATOSHI;IGUCHI TAKASHI;MIURA KATSUYUKI
分类号 H01G4/12;H01C7/10;H01G4/30;H05K1/16 主分类号 H01G4/12
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