| 摘要 |
A method for applying a protective covering for a semi-conductor device which comprises a circuit board having formed thereon a conductive pattern on which a chip of the semi-conductor device is mounted and electrically connected to said conductive pattern, an insulating resin film having a low surface energy to provide a repellent property and formed on said circuit board around the chip of the semi-conductor device by a printing technique, and a resin molded seal formed on said circuit board to conseal said chip within a space defined by said insulating resin film, the flow of resin being blocked by the repellent property of said insulating resin film during a molding process. |
