| 摘要 |
<p>A method is disclosed for producing semiconductor components by contacting the electrodes of disk-shaped semiconductor chips with at least one pn-junction by means of a comb with contact legs. The method includes bending a strip coated with solder on at least one side into a number of identical sections each having a wing-like profile viewed normal to the length of the strip, laying the side of the winged strip opposite the wings on the top main surfaces of the semiconductor chips and pre-attaching it to them. The method further includes aligning a cooling-fin comb and/or leg comb in a soldering jig, introducing the winged strip with the pre-attached semiconductor chips, soldering the resultant comb system which is held together by pressure on the winged strip, cutting apart the conducting links between the semiconductor electrodes formed by the winged strip, lacquering, baking and encapsulating in plastic the comb system except for the ends of the electrode leads formed by the contact legs.</p> |
