| 摘要 |
Vinyl dispersion coating compositions comprising (A) 10-40 parts by weight particulate vinyl resin; (B) 5-80 parts by weight liquid plasticizer; (C) 1-20 parts by weight adhesion promotor comprising (i) a thermoplastic phenol-formaldehyde condensate made with molar excess of the phenol and (ii) a compound that provides low molecular weight difunctional linking moieties with increase in temperature, wherein the molar ratio of the linking moieties releasable by (ii) to the total of hydrogen substituted ortho and para positions in (i) is at least about 3:4, preferably 1:1 or greater, and the weight ratio of (A) to (C) is about 40:1-1:1. Preferred plastisol sealing compositions can exhibit improvements in adhesion to hydrophilic surfaces such as glass by as much as up to five times or greater than with conventional adhesion promoters. |
