发明名称 |
MANUFACTURING METHOD OF SEMIICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE:By embedding the beam-lead in the buried material after the separation of the pellet, one can easily manufacture a semi-conductor device without pay ing attention to electrode location, etc., in design.</p> |
申请公布号 |
JPS5210674(A) |
申请公布日期 |
1977.01.27 |
申请号 |
JP19750087759 |
申请日期 |
1975.07.16 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KITAHIRO ISAMU;IYORI MASAHARU;FUJIMOTO HIROAKI |
分类号 |
H01L21/60;H01L21/28;H01L21/3205;H01L23/52 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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