| 摘要 |
Interconnection is removably provided between a liquid crystal panel and a circuit board or semiconductor chip which provides exchangeability for the liquid crystal panel which is advantageous because of the limited operating life inherent in liquid crystal composites. Contact areas of the circuit chip confront contact areas (or electrode areas) of the liquid crystal panel with interposition of compressible and resilient connector means which complete the circuit therebetween. In one of the preferred embodiments of the present invention, the compressible connector means comprises a rod-like dielectric compressible resilient material such as, for example, rubber and a predetermined number of ring-shaped compressible, reslient electroconductive members such as, for example, conductive rubber. In another preferred form, the electroconductive members comprise discrete stratified conductive members embedded in the rod-like dielectric material in desired alignment with the opposed contact areas.
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