| 摘要 |
PURPOSE:To prevent a mark of the contact surface of a mold from appearing on the head of an optical semiconductor device by checking the contact surface from reaching the head in the resin sealing of the semiconductor device. CONSTITUTION:A fixing plate for a lead frame 34 previously wire-bonded having a pin attached thereto for positioning thereof is mounted to a lower mold of a resin sealing mold comprising an uppor mold and the lower mold. The side of the plate 33 makes a part of the bottom of a cavity. An epoxy resin is injected into the cavity 37 from a resin runner 35 through a gate 38. The joining of the cavity is made avoiding the contact surface from meeting the spherical section. With such an arrangement, the mark of the contact surface of the mold can be checked from appearing on the head of an optical semiconductor device, thereby improving the appearance. |
