发明名称 METAL WIRE BONDING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate the defective bonding for the metal wire bonding by coating and pressure-bonding the edge part of the uncombined metal wire due to the defective work with the metal wire possessing the deformed part extending in a large area than the edge part.
申请公布号 JPS5427364(A) 申请公布日期 1979.03.01
申请号 JP19770092842 申请日期 1977.08.01
申请人 NIPPON ELECTRIC CO 发明人 OOKUBO HIROSHI
分类号 H01L21/60 主分类号 H01L21/60
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