| 摘要 |
Hermetically sealed unit containing an integrated circuit metal oxide semi-conductor chip, wherein a single layer gold-silver alloy serves both to secure the chip within the unit and to form a proper junction with the aluminum alloy conductor connected to a circuit element in said chip. A sufficient proportion of silver is included in the gold-silver alloy whereby said junction retains requisite operational characteristics of bond strength and low resistivity when said unit is subjected to heat for providing a hermetic seal therefor. |
