| 摘要 |
1448831 Electroless Ni plating SIEMENS AG 29 Oct 1973 [31 Oct 1972] 50251/73 Heading C7F An electroless Ni plating bath comprises an aqueous solution (pH 5.5 to 8.5) of a Ni salt, a complex former, sodium hypophosphite and (0.1 to 5 g./l) of a water soluble benzene derivative which is di- or tri-hydroxy benzene which may contain one other functional group or quinone. The complex former may be citrate, acetate or glycolate. The bath may also contain a Cu salt as a stabilizing agent and ammonia. The substrate may be Fe, Cu, Al, brass, ceramics or plastics. |
