| 摘要 |
<p>PURPOSE:To obtain a circuit device whose area required for mounting a semiconductor pellet can be reduced and which can be made thin and small-sized by a method wherein the semiconductor pellet is fit into an opening part made in a substrate. CONSTITUTION:The following are provided: a substrate 1 where an opening part 1a pierced in a thickness direction has been made; a semiconductor pellet 2 fit into the opening part 1a; a bonding wire 3 which connects a wiring pattern 4 formed on the substrate 1 to the pellet 2; a resin 5 with which the surface on the side of the bonding wire of the pellet 2 is coated; a bonding material 6 which bonds the rear of the pellet 2 to the substrate 1. For example, the surface of an IC pellet 2 and a wire 3 are coated with a silicone-based protective coating resin 5; an end part of the rear of the IC pellet 2 is connected electrically to a conductor pattern 4 formed on the rear of a substrate 1 by using a conductive epoxy-based adhesive 6; the IC pellet 2 and the substrate 1 are fixed by using the adhesive 6; in addition, the whole is coated with an outer packaging material 9.</p> |
