KUPFERLEGIERUNG UND VERFAHREN ZU IHRER HERSTELLUNG

摘要

The alloy contains by wt. 0.01-0.4% boron, which is pref. distributed uniformly along the grain boundaries of the alloy and/or in the matrix. To make the alloy, boron tablets (a) are pref. added during or after melting Cu; tablets (a) consist of (a1) CaB6 low in carbon and free from Si; plus (a2) Cu turnings; using wt. ratio a1:a2 of between 1:2 and 1:9; the Cu is pref. melted at 1000 degrees C. The resulting alloy is pref. soln. treated and quenched; cold worked 5-95%, pref. 25-80%, and esp. 70%; then aged at 100-400 degrees C for between a few minutes and several days. The alloy has high tensile strength combined with high electrical conductivity of e.g. 55-56.5 m-ohms/mm2, i.e. similar to that of electrolytic Cu.