发明名称 Flow molding surface of plastic and conductive particles
摘要 Thermosetting molds are formed with electrically conductive surfaces for use in high frequency energy flow molding of sheet materials. Preferably the mold of this invention has a highly electrically conductive layer preferably in an epoxy gel coat carrying electrically conductive particles of gold, silver or platinum and positioned over a compatible epoxy mold body. A vacuum molding technique is used to obtain good surface definition in surface molding.
申请公布号 US4140461(A) 申请公布日期 1979.02.20
申请号 US19770826179 申请日期 1977.08.19
申请人 ALLIED RESIN CORPORATION 发明人 WILEY, PAUL J.;DAVIS, ROBERT
分类号 B29C33/08;B29C33/56;B29C59/00;B29C70/88;B29D35/14;(IPC1-7):B29C23/00 主分类号 B29C33/08
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