LOW-SHRINK THERMOSETTING POLYMERS

摘要

The invention pertains to a one-part low-shrink or low-profile molding composition based on a dicyclopentadiene modified polyester resin. The molding resin compositions are stabilized emulsion comprising a thermosetting unsaturated polyester polymer modified with dicyclopentadiene, an ethylenically unsaturated monomer copolymerizable with the thermosetting polyester polymer, and a thermoplastic resin having acid groups whereby the molding resin compositions are suitable for thickening with alkaline earth and/or hydroxide thickeners.