| 摘要 |
<p>A semi-conductor package comprising an electrically and thermally conductive body (13, 14) defining a heat sink for the package, a thyristor (11) mounted on the body and having one of its anode and cathode terminals electrically connected thereto, a plurality of diodes (12) mounted on the body (13, 14) in angularly spaced relationship around the thyristor (11), each diode (12) having one terminal of opposite polarity to said one terminal of the thyristor (11) electrically connected to the body (13, 14) at least one electrically conductive element (19) extending between and electrically connecting the other teminal of each diode (12) and the other of said anode and cathode terminals of the thyristor (11), housing (13, 23, 25, 26) isolating the thyristor and the diodes from atmosphere, and a conductive contact member (27, 21) electrically connected to the gate of the thyristor (11) and exposed at the exterior of said housing.</p> |
