发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve heat dissipation effect, make possible assembling works of using magnets and improve productivity by constituting the lead wires to be mounted to a double heat sink diode with a core wire composed of a ferromagnetic material and a covering wire of a high heat conductivity material enclosing this.
申请公布号 JPS5419670(A) 申请公布日期 1979.02.14
申请号 JP19770084252 申请日期 1977.07.15
申请人 HITACHI LTD 发明人 TERAKADO HAJIME;MOROSHIMA HEIJI
分类号 H01L23/36;H01L23/48;H01L25/00 主分类号 H01L23/36
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