发明名称 SEAL MOLDING APPARATUS
摘要 PURPOSE:To improve the efficiency of chip molding by a method wherein a pair of linear runners are coupled to one cull, a plurality of them are provided in one mold, a pot being opposite to each cull is provided for an inner tool and a plunger put in each pot is provided for a top force. CONSTITUTION:A bottom tool 10 is separated into a plurality of blocks, one cull is formed in the center of each block, and a linear short runner 2 is provided in two directions for each cull 11. A cavity 3 accommodating a diode chip is connected to the runner 2 through a gate 4. An inner tool 20 is provided with pots 1 in the number corresponding to the culls 11 in the bottom tool, while a top force 30 is provided with a plunger 7 to be put in each pot 1. On the occasion when the diode chip is accommodated in each cavity 3 and when the tools and the force 10, 20 and 30 are assembled and a plastic tablet 6 is put in the pot 1 and pressed by the plunger 7 to be poured into the cavity 3 from the cull 11, accordingly, the chip can be sealed up airtightly, since the runner 2 is linear and short.
申请公布号 JPH02127019(A) 申请公布日期 1990.05.15
申请号 JP19880280753 申请日期 1988.11.07
申请人 FUJI ELECTRIC CO LTD 发明人 IDE MINORU
分类号 B29C45/02;B29C45/26;B29K105/20;B29L31/34;H01L21/56 主分类号 B29C45/02
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